Taiwan Semiconductor Manufacturing Company (TSMC) will break ground for the fifth phase construction of its 12-inch wafer plant in central Taiwan in May, according to industry sources.
TSMC will complete the installation of cleanroom facilities at the new facility in May 2016, followed by volume production at the end of the year, said the sources.
The Fab 15 Phase 5 facility will be mainly for the manufacture of chips using TSMC's 10nm process technology, the sources noted.
TSMC's co-CEO Mark Liu has reiterated the company's goal of moving its 10nm process to trial production at the end of 2016 followed by commercial production in 2017.
TSMC expects its 10nm process technology to contribute 55% to the company's revenues in 2020, Liu remarked previously.
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