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Sunday 19 April 2015

China market: Intel to strengthen presence in mobile CPU market via ODMs and white-box vendors

Intel reportedly will step up its cooperation with ODMs and white-box makers in China to strengthen its presence in China's handset market. Some vendors will launch 3G smartphones built using Intel's quad-core solutions in the third quarter of 2015 and release 4G LTE models in the fourth quarter, according to industry sources.

Intel will provide ODMs and white-box makers with turnkey solutions, which many include chipsets, reference designs, software and developing tools for production of mobile devices - an approach similar to that used by MediaTek and Qualcomm, indicated the sources.

Under the cooperation pacts, more China-based ODMs and white-box makers have recently released smartphones, tablets and other mobile devices based on Intel's SoFIA X3 platform, the sources indicated.

Intel has begun volume shipments of its 3G dual-core C3130 chips to support the production and is expected to begin volume production of its quad-core C3230 solutions soon, said the sources.

Intel's more advanced chipsets supporting LTE technology and Ultra HD (4K) displays are likely to come at the end of 2015, the sources added.

China-based vendors that have adopted Intel's solutions include BYD Electronic, Yuko Technology, Water World Technology and Bluebank Communication Technology, revealed the sources.

The majority of Intel's solutions support Android platforms and some support Windows 8 currently. Intel is scheduled to releases chipsets supporting Windows 10, the sources added.

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