TSMC will make all of the microprocessors for the iPhone 7 that is due to debut in 2016 using its 16nm FinFET manufacturing process, according to a Chinese language report.
Taiwan's Commercial Times referenced unnamed people in Apple's supply chain as sources for the story.
This would represent a rejection for Samsung and Globalfoundries – its partner in 14nm FinFET manufacturing. Samsung is thought to have a 50 percent share of production of the current processor, the A9 which is shipping in the recently launched iPhone 6 and iPhone 6 Plus. It would also be a bounce back into Apple's favor for TSMC.
Mass production of the A10 processor is expected to start in March 2016 so that parts can be ready for the iPhone 7 to launch in about September 2016. In addition Apple's A10 will use TSMC's integrated fan-out (InFO) wafer-level packaging technology, the report said.
This would represent a rejection for Samsung and Globalfoundries – its partner in 14nm FinFET manufacturing. Samsung is thought to have a 50 percent share of production of the current processor, the A9 which is shipping in the recently launched iPhone 6 and iPhone 6 Plus. It would also be a bounce back into Apple's favor for TSMC.
Mass production of the A10 processor is expected to start in March 2016 so that parts can be ready for the iPhone 7 to launch in about September 2016. In addition Apple's A10 will use TSMC's integrated fan-out (InFO) wafer-level packaging technology, the report said.
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